PLATING SPECIALIST, SILICON ASSEMBLY (STARLINK)

One of the most ambitious missions that SpaceX has undertaken to date, the Starlink satellite constellation, is our solution to providing reliable internet to the entire world.  In true SpaceX fashion, Starlink is taking the next step in vertical integration by bringing integrated circuit packaging and assembly in-house for development and manufacturing. You will work closely with IC packaging engineers, test engineers, equipment manufacturers, and leadership.

The success of Starlink depends on the quality, reliability, cost, manufacturability, throughput, and security of the products that you deliver. If you seek a fast-paced, dynamic environment; if you thrive on solving difficult problems where resolutions have high impact; and if you love the challenge of building something from scratch, then this role will be an ideal next career step.

RESPONSIBILITIES:

• Operate and maintain electrochemical plating equipment, including copper electroplating tools and seed layer deposition systems, to achieve uniform metal deposition with controlled thickness and adhesion on patterned wafers
• Monitor and optimize plating process parameters, such as current density, electrolyte composition, pH, temperature, and additive levels, to ensure void-free fills, low resistivity, and minimal stress in deposited films
• Perform analysis and replenishment, including titration for chemistry control, filtration for particle removal, and waste treatment to maintain plating solution purity and environmental compliance
• Conduct post-plating metrology and inspections using tools like X-ray fluorescence (XRF), four-point probe, and cross-section SEM to verify film thickness uniformity and defect density
• Troubleshoot plating anomalies, such as overplating, underplating, or contamination, through root cause analysis and implement process adjustments to enhance yield and reliability
• Collaborate cross-functionally with members from lithography, thin films, etch, dry films, and other teams on root cause analysis, yield, and efficiency improvement projects
• Document process data, generate reports on key performance metrics (e.g., plating rate, coverage efficiency, electromigration resistance), and participate in design of experiments (DOE) for various process improvements
• Adhere to safety protocols for handling hazardous chemicals while following cleanroom standards and ESD procedures

BASIC QUALIFICATIONS:

• High school diploma or equivalency certificate  
• 3+ years of professional experience in a hands-on manufacturing environment; OR bachelor's degree in an engineering, math or science discipline

PREFERRED SKILLS AND EXPERIENCE:

• Bachelor's degree in chemical engineering, materials science, electrochemistry, or a related field
• 3+ years of hands-on experience in electrochemical plating or electrodeposition within a semiconductor fabrication environment
• Proficiency in electroplating techniques for metals like Cu, Ni, Au, Ti, Rh, Pd, Co
• Familiarity with process control and data analysis tools (e.g., Excel, SPC software) for monitoring plating performance and variability
• Experience with advanced packaging plating multiple redistribution layers (RDL) or advanced node interconnects
• Certification in electrochemistry or semiconductor processing (e.g., SEMI standards) and familiarity with automation in plating lines
• Background in yield enhancement projects, electrochemical modeling, or integration with fab MES systems
• Commitment to safety and quality, with excellent problem-solving skills in a high-precision setting

ADDITIONAL REQUIREMENTS:

• Must be able to work all shifts and be willing to work overtime and/or weekends as needed
• Standing for long periods of time, climbing up and down ladders, bending, grasping, sitting, pulling, pushing, stooping, and stretching may be required to perform the functions of this position
• Must be able to lift up to 35lbs. unassisted