Senior Process Engineer (Starlink)

SR. PROCESS ENGINEER (STARLINK)

Keeping our production tools running and our processes stable is what turns engineering designs into product at volume. We are seeking a Sr. Process Engineer to own the day-to-day operation, uptime, and optimization of the packaging and assembly tools on our production floor.

RESPONSIBILITIES

• Own day-to-day operation and uptime of production tools including flip-chip bonders, plasma cleaners, de-flux tools, automated handlers, dispense tools, and wire bonders
• Design production processes from the lab bench through proof of concept and production ramp
• Monitor and control key process parameters, ensuring repeatability, equipment calibration, and adherence to manufacturing specs
• Troubleshoot tool and process issues in real-time, minimizing downtime, and driving fast root-cause resolution
• Collaborate with engineering teams to stabilize and improve process flows for die attach, bonding, cleaning, and packaging
• Analyze production data and yield trends, identifying opportunities for process optimization and defect reduction
• Push process yields above 99.9% and thermal-cycle reliability beyond 1000 cycles
• Support factory scaling efforts, qualifying new tools and recipes that enhance unit throughput and yield

QUALIFICATIONS

• BS or MS in an engineering discipline
• 5+ experience in semiconductor packaging, assembly, process engineering or advanced manufacturing 

PREFERRED EXPERIENCE

• Direct experience qualifying or operating production equipment in a high-volume production environment
• Knowledge of sub-µm die-bonding, wafer prep, and materials used in advanced packaging
• Familiarity with statistical process control and root cause analysis methods
• 2+ years of experience in process development or yield improvement for optical, photonic, or microelectronic devices
• Strong troubleshooting skills with experience maintaining high-uptime operation of precision manufacturing tools
• Familiarity with equipment and processes such as flip-chip bonding, wafer processing, plasma cleaning, and wire bonding
• Ability to interpret process documentation, equipment specifications, and production data to drive consistent output

ADDITIONAL REQUIREMENTS

• Comfortable working in a cleanroom or controlled manufacturing environment with cross-functional engineering teams
• Willingness to work extended hours and weekends as needed