Wet Process, CMP and Bond MDE Principal Lead Engineer

Full Timelead

Boise, ID - Main SitePosted 7 days ago

Role Overview

Micron Technology is hiring a Wet Process, CMP and Bond MDE Principal Lead Engineer. This is a full-time role in Boise, ID - Main Site. posted last week. Full responsibilities, required qualifications, and the apply link are listed in the description below.

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Job description

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

We are the team that powers next-generation DRAM technology development through strong execution and rapid learning. We work at the center of innovation—partnering across process, integration, equipment, and manufacturing teams to translate ideas into scalable solutions. If you enjoy leading from the front and building high-performing engineering teams, this is an exciting place to make an impact.

In this role, you will lead a team responsible for wet process, CMP, and bonding development execution. You will combine people leadership with deep technical direction to drive fast, reliable development cycles. Your work will directly influence technology achievements, while helping engineers grow into future process development leaders.

Responsibilities:

Lead multi-functional execution of process development priorities to accelerate DRAM technology learning and roadmap delivery
Drive wafer movement, data quality, process monitoring, and resolution of customer concerns to ensure strong development outcomes
Lead 24/7 shift operations, including benchmarks, cycle time, tool performance, and line-down recovery
Mentor and develop engineers, building a pipeline of talent into process development roles
Improve workflows, development systems, and AI adoption to improve efficiency and decision quality

Minimum Qualifications:

Bachelor’s degree in Engineering or equivalent experience in the semiconductor field
Demonstrated leadership experience in a technical or manufacturing environment
Experience in at least one core area: wet process, CMP, wafer bonding, grinding, or edge trimming
Strong problem-solving and interpersonal skills

Preferred Qualifications:

5+ years of semiconductor process development experience
Deep expertise in one core process area and working knowledge across related areas
Experience in shift-based manufacturing or technology development environments
Proven ability to collaborate across functions and mentor emerging engineers
Experience leveraging AI, Generative AI, or AI-enabled solutions to improve engineering outcomes

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

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To learn more about Micron, please visit micron.com/careers

For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at hrsupport_na@micron.com or 1-800-336-8918 (select option #3)

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.

Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.

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Frequently Asked Questions

How do I apply for the Wet Process, CMP and Bond MDE Principal Lead Engineer position at Micron Technology?

Use the Apply button above to submit your application directly to Micron Technology. Most applications take less than 5 minutes if your resume and contact details are ready, and you'll be routed to the employer's official application system to finish.

Where is the Wet Process, CMP and Bond MDE Principal Lead Engineer position at Micron Technology located?

This position is based in Boise, ID - Main Site. Micron Technology has not indicated remote or hybrid options for this role, so candidates should plan for on-site work.

What does a Wet Process, CMP and Bond MDE Principal Lead Engineer at Micron Technology earn?

Micron Technology has not disclosed a salary range in this posting. Many employers share specifics later in the interview process; you can also ask during a recruiter screen if compensation transparency is important to you.

When was the Wet Process, CMP and Bond MDE Principal Lead Engineer role at Micron Technology posted?

This role was posted on July 13, 2026 (7 days ago). It's still listed as actively hiring; we re-confirm openings against the source system multiple times per day and remove closed roles.