Quality Engineer (Backend Module Packaging)

Monitor and ensure all backend packaging processes (Die Attach, Wire Bond, Encapsulation, etc.) comply with internal quality standards and customer specifications.

Conduct incoming, in-process, and final quality inspections; define and update inspection criteria and control plans.

Review and approve quality documentation including inspection reports, non-conformance reports (NCR), and corrective action requests (CAR).

Lead or support customer quality complaints investigation and provide timely 8D reports or resolution updates.

Quality Systems & Continuous Improvement

Apply FMEA (Failure Mode and Effects Analysis) and Root Cause Analysis methodologies (e.g., 5 Whys, Fishbone) to identify, analyse, and eliminate quality issues.

Support the development, implementation, and maintenance of the ISO9001 Quality Management System (QMS) in preparation for certification audits.

Establish and maintain a basic document control database for quality records, SOPs, work instructions, and audit trails to ensure readiness for internal/external audits.

Drive continuous improvement projects to reduce defects, improve yield, and enhance process capability (Cpk/Ppk).

Cross-Functional & International Collaboration

Serve as the primary quality contact for technical communication with our main company/technical team in China ; provide clear updates, data, and recommendations to resolve quality challenges.

Collaborate with Production, Engineering, and R&D teams to implement quality controls at the early stages of process development.

Conduct quality training for operators and technicians on GMP, inspection techniques, and defect recognition.

Audits & Compliance

Prepare for and support internal audits, customer audits, and third‑party certification audits.

Track closure of audit findings and ensure corrective/preventive actions are effectively implemented.

Requirements & Qualifications

Education & Experience

Diploma or Degree in Engineering (Electrical, Electronics, Mechanical, Materials) or related field.

Minimum 2–4 years of experience in quality engineering within backend semiconductor manufacturing or related electronics packaging industry.

Preferred technical knowledge in one or more backend processes: Die Attach (DA), Wire Bond (WB), Encapsulation (ENCAP), Singulation Punch/Testing.

Hands‑on experience with ISO9001 implementation or maintenance is highly advantageous.

Proficiency in quality tools: FMEA, Root Cause Analysis, 8D, SPC, MSA is required.

Strong analytical and problem‑solving skills with a data‑driven approach.

Excellent written and verbal communication skills in English .

Proficiency in Mandarin is required to work with regional stakeholders.

Proficient in Microsoft Office (Excel, PowerPoint, Word); experience with document management systems or QMS software is a bonus.

Self‑starter with ability to work independently in a start‑up environment and manage multiple priorities.

High attention to detail, integrity, and commitment to quality standards.

Work Arrangement

Working Hours: Monday to Friday, 8:00 AM to 5:00 PM (Office Hours)

Occasional overtime may be required during critical production phases or audit periods.

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