Mechanical Design Engineer – Power Electronics Systems

Job Description: Mechanical Design Engineer – Power Electronics Systems

Company: Autodata Technologies Pvt. Ltd., Navi Mumbai Location: Navi Mumbai

(TTC Industrial Area) Experience: 3–8 years Qualification: B.E. / Diploma (Mechanical Engineering)

Role Overview

You will be responsible for the mechanical design, enclosure engineering, and thermal management of high-power industrial electronic assemblies including IGBT three-phase stacks, IGBT-based inverters (100–200 kW), and SMPS power supplies for the electroplating and surface treatment industry.

Key Responsibilities

∙Mechanical design and 3D modelling of power electronics enclosures,

busbars, heatsink assemblies, and mounting structures using "Autocad, Solid Works, Krycad"

∙Thermal analysis and heat removal design — heatsink selection, forced air cooling (fans, ducting), liquid cooling plates, and thermal interface material

(TIM) specification

∙Design of IGBT three-phase stack assemblies including clamping pressure,

isolation, busbar geometry, and creepage/clearance compliance per IEC

60664

∙Mechanical packaging of SMPS units for industrial environments — DIN rail,

19" rack, or custom enclosures

∙BOM preparation, vendor coordination for sheet metal fabrication, extrusions,

and machined parts

∙Review of manufacturing drawings, GD&T, and tolerance stack-up analysis

∙Coordination with electrical/electronics team for PCB mounting, connector layouts, and cable management

∙Prototype build support and design iteration based on thermal test results ust-Have Skills

∙Proficiency in Kryad mechanical design software (or KiCad for PCB mechanical integration)

∙Demonstrated experience with thermal management — heatsink design,

CFD awareness, junction-to-ambient thermal resistance calculations

∙Experience with IGBT module mounting — torque specs, thermal compound application, isolation pads (e.g., Keratherm, Bergquist)

∙Sheet metal design for fabrication (bending, punching, powder coating)

∙Familiarity with IP ratings (IP20 to IP54), EMC enclosure requirements, and cable gland sizing

Good-to-Have

∙Exposure to electroplating rectifiers, CED paint shop equipment, or industrial

UPS/inverter systems

∙Knowledge of IEC 61439 (switchgear enclosure standard)

∙Experience with busbar design software or manual calculation of current density and temperature rise

∙SolidWorks Simulation / ANSYS for basic thermal FEA