Principal Engineer, Electrical Engineering – Advanced Packaging

US > Arizona > PhoenixPosted 17 days ago

Role Overview

Assembly is hiring a Principal Engineer, Electrical Engineering – Advanced Packaging. This is a full-time role in US > Arizona > Phoenix. posted 2 weeks ago. Full responsibilities, required qualifications, and the apply link are listed in the description below.

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Job description

Step into a career with ASM, where cutting edge technology meets collaborative culture.

For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving.  But we’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world. Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential.

Role Overview

The Principal Electrical Engineer is a technical leader responsible for defining, designing, and governing the electrical architecture of advanced semiconductor packaging equipment (etch, deposition, etc.). This role drives system-level electrical design excellence, ensures compliance with industry standards, and partners closely with systems, mechanical, process, and manufacturing teams to deliver robust, scalable, and high-performance tools.

Key Responsibilities

Define and own the electrical system architecture for advanced packaging semiconductor tools, including power distribution, grounding, EMC/EMI, controls, and safety systems.

Develop and decompose electrical requirements for subsystems such as RF power delivery, motion control, sensors, PLC/safety systems, and mixed-signal electronics.

Lead system and electrical design reviews (SRR, PDR, CDR).

Ensure compliance with SEMI standards, CE/UL, EMC, and safety regulations.

Collaborate with systems engineering to align architecture and requirements.

Partner with process engineering to correlate electrical behavior with wafer performance.

Lead root cause analysis of electrical and electromechanical issues.

Drive DFMEA/FMEA, reliability analysis, and risk mitigation.

Mentor engineers and establish best practices.

Support product roadmap planning and innovation.

Work with manufacturing and supply chain for scalability and robustness.

Required Qualifications

Bachelor’s or Master’s degree in Electrical Engineering or related field.

10+ years of experience in semiconductor capital equipment.

Expertise in RF systems, motion control, power distribution, or safety systems.

Knowledge of SEMI standards, CE/UL, and EMC regulations.

Experience with requirements management and FMEA.

Proven technical leadership in complex programs.

Preferred Qualifications

Experience with advanced packaging tools.

Familiarity with PLCs and real-time control systems.

Experience in certification and field issue resolution.

Track record of influencing product architecture.

Apply today to be part of what’s next.

We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what’s possible through cutting-edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect.

To learn more about ASM, find us at asm.com and on LinkedIn, Facebook, Instagram, X and YouTube.

ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identify or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.

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Frequently Asked Questions

How do I apply for the Principal Engineer, Electrical Engineering – Advanced Packaging position at Assembly?

Use the Apply button above to submit your application directly to Assembly. Most applications take less than 5 minutes if your resume and contact details are ready, and you'll be routed to the employer's official application system to finish.

Where is the Principal Engineer, Electrical Engineering – Advanced Packaging position at Assembly located?

This position is based in US > Arizona > Phoenix. Assembly has not indicated remote or hybrid options for this role, so candidates should plan for on-site work.

What does a Principal Engineer, Electrical Engineering – Advanced Packaging at Assembly earn?

Assembly has not disclosed a salary range in this posting. Many employers share specifics later in the interview process; you can also ask during a recruiter screen if compensation transparency is important to you.

When was the Principal Engineer, Electrical Engineering – Advanced Packaging role at Assembly posted?

This role was posted on July 6, 2026 (17 days ago). It's still listed as actively hiring; we re-confirm openings against the source system multiple times per day and remove closed roles.