Role Overview:

You are sought after for your expertise as an Aerospace Mechanical Engineer specializing in Electronic Packaging. Your main responsibility will be to lead the physical design and integration of safety-critical avionics hardware. This involves bridging the gap between mechanical structures and electronic systems to ensure that complex PCB assemblies can withstand extreme thermal, vibration, and EMI environments commonly found in aerospace applications. Your deep understanding of thermal management and experience in designing ruggedized enclosures meeting stringent aerospace standards will be crucial in this role.

Key Responsibilities:

• Physical Architecture: Design 3D mechanical layouts for avionics boxes (LRUs), including enclosure design, connector placement, and internal mounting structures.
• Thermal Analysis: Perform detailed thermal modeling (CFD) to ensure components remain within protected operating temperatures during high-altitude and high-temperature conditions.
• Structural Integrity: Conduct Finite Element Analysis (FEA) for shock, random vibration, and acceleration loads to ensure mechanical reliability over the aircraft's lifecycle.
• EMI/EMC Shielding: Design enclosures with integrated Faraday shielding and grounding strategies to protect sensitive electronics from electromagnetic interference.
• Manufacturing Liaison: Work closely with PCB designers and manufacturing teams to optimize Design for Manufacturing (DfM) and Design for Assembly (DfA).
• Documentation & Certification: Generate comprehensive engineering drawings, Bill of Materials (BOMs), and test reports required for FAA/EASA certification.

Qualifications Required:

• Education: Bachelors or Masters degree in Mechanical Engineering, Aerospace Engineering, or a related field.
• Experience: Minimum 5+ years in aerospace mechanical design, with at least 3 years focused specifically on electronic packaging/ruggedization.
• Software Proficiency:
• CAD: Expert-level skills in SolidWorks, CATIA, or Siemens NX.
• Simulation: Proficiency in Ansys (Icepak/Mechanical), FloTHERM, or Altair SimLab.
• Technical Knowledge: Deep understanding of materials science (e.g., aluminum alloys, composites, thermal interface materials). Familiarity with aerospace plating and finishing (e.g., Alodine, Anodizing). Knowledge of GD&T; (Geometric Dimensioning and Tolerancing) per ASME Y14.5.

Preferred Attributes:

• Experience with DO-160 environmental testing procedures.
• Knowledge of additive manufacturing (3D printing) for lightweight aerospace brackets and heat sinks.
• Understanding of board-level packaging, including solder joint reliability and CTE (Coefficient of Thermal Expansion) mismatch mitigation. Role Overview:

You are sought after for your expertise as an Aerospace Mechanical Engineer specializing in Electronic Packaging. Your main responsibility will be to lead the physical design and integration of safety-critical avionics hardware. This involves bridging the gap between mechanical structures and electronic systems to ensure that complex PCB assemblies can withstand extreme thermal, vibration, and EMI environments commonly found in aerospace applications. Your deep understanding of thermal management and experience in designing ruggedized enclosures meeting stringent aerospace standards will be crucial in this role.

Key Responsibilities:

• Physical Architecture: Design 3D mechanical layouts for avionics boxes (LRUs), including enclosure design, connector placement, and internal mounting structures.
• Thermal Analysis: Perform detailed thermal modeling (CFD) to ensure components remain within protected operating temperatures during high-altitude and high-temperature conditions.
• Structural Integrity: Conduct Finite Element Analysis (FEA) for shock, random vibration, and acceleration loads to ensure mechanical reliability over the aircraft's lifecycle.
• EMI/EMC Shielding: Design enclosures with integrated Faraday shielding and grounding strategies to protect sensitive electronics from electromagnetic interference.
• Manufacturing Liaison: Work closely with PCB designers and manufacturing teams to optimize Design for Manufacturing (DfM) and Design for Assembly (DfA).
• Documentation & Certification: Generate comprehensive engineering drawings, Bill of Materials (BOMs), and test reports required for FAA/EASA certification.

Qualifications Required:

• Education: Bachelors or Masters degree in Mechanical Engineering, Aerospace Engineering, or a related field.
• Experience: Minimum 5+ years in aerospace mechanical design, with at least 3 years focused specifically on electronic packaging/ruggedization.
• Software Proficiency:
• CAD: Expert-level skills in SolidWorks, CATIA, or Siemens NX.
• Simulation: Proficiency in Ansys (Icepak/Mechanical), FloTHERM, or Altair SimLab.
• Technical Knowledge: Deep understanding of materials science (e.g., aluminum alloys, composites, thermal interface materials). Familiarity with