Job Title: Semiconductor Manufacturing Engineer / Process Engineer

Maxim SMT Technologies Pvt. Ltd.

Job Summary

We are seeking a skilled and detail-oriented professional with hands-on experience in semiconductor manufacturing and electronic component assembly. The ideal candidate will have strong expertise in die bonding and wire bonding processes, along with a solid understanding of semiconductor fabrication and packaging techniques.

Key Responsibilities:

• Execute and optimize semiconductor manufacturing processes, ensuring high quality and yield.
• Perform and support die bonding and wire bonding operations for electronic components.
• Troubleshoot process issues and implement corrective actions to improve efficiency and reliability.
• Work closely with production, quality, and engineering teams to meet manufacturing targets.
• Monitor equipment performance and coordinate maintenance or calibration as required.
• Ensure adherence to process specifications, safety standards, and quality guidelines.
• Analyze production data and recommend process improvements.
• Support new product introduction (NPI) and process development activities.

Required Qualifications:

• Diploma/Bachelor’s degree in Electronics, Electrical Engineering, Semiconductor Engineering, or a related field.
• 1–8 years of experience in semiconductor manufacturing or electronic component assembly.
• Hands-on experience in die bonding and wire bonding processes.
• Strong understanding of semiconductor packaging and assembly techniques.
• Familiarity with cleanroom environments and manufacturing protocols.
• Good problem-solving and analytical skills.
• Ability to work in a team-oriented, fast-paced environment.

Pay: ₹25,000.00 - ₹40,000.00 per month

Ability to commute/relocate:

• Sanand, Gujarat (Sanand): Reliably commute or planning to relocate before starting work (Preferred)

Experience

• Semiconductor: 1 year (Preferred)
• Wire Bonding: 1 year (Preferred)
• Die Bonding: 1 year (Preferred)

Work Location: In person