Mechanical Program Lead Engineer

The Group You'll Be A Part Of

Hiring a Mechanical Program Lead Engineer for its product development engineering and product ownership team.

Job Summary

As an Mechanical Program Lead Engineer, you will lead the design, development, and technical ownership of complex mechanical and electro-mechanical subsystems for wafer fabrication equipment. You will drive early feasibility and architecture decisions, execute detailed design and validation, and ensure robust release to manufacturing through disciplined requirements, risk management, and cross-functional execution. This role partners closely with global engineering, program, and supplier teams to deliver reliable, cost-effective, and serviceable hardware for WETS Deposition product development programs.

Key Responsibilities

• Lead end-to-end design and delivery of complex subsystems and system-level mechanical architectures for semiconductor processing equipment (e.g., process chambers, chemical delivery, frames, thermal subsystems, automation interfaces, and motion-controlled assemblies).
• Drive technical planning: scope definition, requirements decomposition, concept selection, and risk mitigation using engineering calculations, dFMEA, and DfX.
• Own detailed design execution: design reviews, tolerance strategy (GD&T), drawing/model release, and configuration/change management.
• Plan and lead verification and validation: feasibility builds, test plan development, instrumentation strategy, data review, and design closure.
• Partner with cross-functional global teams (electrical, systems, software, process, program management, product support, quality) to integrate subsystems and deliver program milestones.
• Engage suppliers and manufacturing engineering to ensure design for manufacturability/assembly/service, cost targets, quality, and on-time delivery.
• Lead structured troubleshooting and reliability improvements (RCCA/8D/5-Why) for field and factory issues impacting safety, uptime, yield, and productivity.
• Provide technical mentorship and review for junior engineers; set expectations for analysis quality, documentation, and engineering rigor.
• Develop and continuously improve design standards, Best Known Methods (BKMs), and reusable design content.

Minimum qualifications

• Education: B.E. / B.Tech / M.E. / M.Tech in Mechanical Engineering
• Experience: 8 to 12 years of relevant experience, preferably in semiconductor equipment engineering

Core Competencies

• Strong mechanical design fundamentals with hands-on ownership from concept through release for high-reliability hardware.
• Expertise selecting materials and finishes for semiconductor environments (metals, ceramics, quartz, polymers, coatings) with contamination and thermal considerations.
• Proficiency in engineering analyses: structural/FEA, thermal/heat transfer, stress and vibration, and fluid/gas flow as applicable.
• Experience with requirements definition and verification/validation planning at system and subsystem level.
• Working knowledge of DoE, FMEA, and DfX (cost, manufacturability, assembly, reliability, safety, testing, and serviceability).
• Strong documentation discipline aligned with Lam/SEMI practices, including GD&T and configuration control.
• Structured problem-solving experience (RCCA, 8D, 5-Why, Fishbone) with a track record of closing issues with data.
• Broad manufacturing knowledge (machining, sheet metal, welding, polymers) and exposure to additive manufacturing.
• Strong communication and stakeholder management skills; ability to influence across teams and drive decisions in design/program reviews.