Company Description

AI Chips specializes in developing custom chip solutions to accelerate Machine Learning (ML) for practical, real-world applications. Our advanced ASIC and FPGA solutions are designed to meet the industry's demand for devices with lower Size, Weight, Power, and Cost (SWaP-C) compared to traditional CPU and GPU designs. AI Chips is at the forefront of innovation, providing tailored silicon solutions that meet high-performance needs while maximizing efficiency and cost-effectiveness. We are passionate about redefining possibilities in AI hardware technology.

Role Description

AI Chips is seeking a hands-on Physical Design & STA Engineer with 5-10 years of experience and a strong track record of 5-10 tape outs to join our team in a full-time capacity. This on-site role, based in Kolkata, India, joining a small team to execute physical implementation and Static Timing Analysis (STA) across various projects, with an emphasis on AI silicon. The role includes floorplanning, timing closure, place and route (PnR), and collaborating with cross-functional teams to deliver high-quality solutions that meet critical schedules.

If you want to accelerate your growth by contributing to real architecture, real RTL, and real silicon — not just running regressions — this role gives you that runway.

Key Skills and Responsibilities

• Perform full physical design implementation: synthesis, floorplanning, power planning, placement, CTS, routing, extraction, ECOs, and signoff.
• Run and own STA directly: MCMM analysis, derates, OCV/AOCV/POCV, constraint development, and timing closure.
• Execute top‑level integration: build block abstracts, define timing budgets, run top‑level STA, and close chip‑level timing yourself.
• Drive PPA optimization hands‑on: identify critical paths, perform placement/clocking optimizations, and propose RTL fixes.
• Perform IR/EM analysis: run static/dynamic IR drop, EM checks, and implement mitigation strategies.
• Run physical verification: DRC, LVS, ERC, antenna, density, and foundry signoff.
• Execute late‑stage ECOs: functional, timing, and physical ECOs across the final closure window.
• Develop automation: write Tcl/Python scripts to improve timing analysis, PPA reporting, and signoff flows.
• Collaborate tightly with RTL, architecture, and verification to drive timing‑aware design decisions.
• Participate in design reviews and maintain high‑quality documentation and design collateral.
• Grow into owning full blocks as you gain confidence and experience.

Job Roles and Responsibilities

• 5–10 years of physical design and STA experience with 5–10 successful tapeouts
• Location: Kolkata, India
• Qualifications: B.Tech, M.Tech, Ph. D., in Electrical Engineering, Computer Engineering, or related field
• Deep, hands‑on expertise with: (1) STA: PrimeTime or Tempus; (2) P&R: Innovus, ICC2, or Fusion Compiler; (3) Synthesis: Genus or Design Compiler; (4) Physical verification: Calibre or Pegasus
• Proven ability to personally close timing on complex, high‑frequency designs
• Strong understanding of: Clocking (mesh, H‑tree, multi‑source CTS), Power grid design, IR/EM analysis, Advanced‑node physical effects (variation, SI, RC extraction)
• Strong scripting skills (Tcl, Python, Shell)
• Experience with AI/ML accelerators, GPUs, DSPs, or high‑performance compute is a plus.
• Ability to work in a fast‑moving, high‑ownership startup environment.
• Experience in collaborating with engineering teams
• Strong analytical and problem-solving skills
• Excellent communication and teamwork skills

Why This Role Matters

• You are the engineer who ensures the chip meets frequency, power, and area targets.
• You directly drive timing closure, IR/EM integrity, and signoff quality.
• Your hands‑on execution determines whether the chip tapes out on schedule.

Why Join Us

• Architect and execute the backend flow for a ground‑up AI accelerator.
• Own top‑level physical design and STA with real autonomy.
• Work with a small, elite team where your contributions directly shape the silicon.
• High impact, high ownership, and early‑stage equity.